发明申请
US20040118590A1 Conductor system 有权
导体系统

  • 专利标题: Conductor system
  • 专利标题(中): 导体系统
  • 申请号: US10481871
    申请日: 2004-01-16
  • 公开(公告)号: US20040118590A1
    公开(公告)日: 2004-06-24
  • 发明人: Philip Head
  • 优先权: GB0115040.8 20010620; GB0119622.9 20010811; GB0211385.0 20020517
  • 主分类号: H01B009/02
  • IPC分类号: H01B009/02
Conductor system
摘要:
A connection is formed to a cable for transmitting power or telemetry data in a down hole environment. The cable includes a conductor, and a tubular metallic impermeable layer around the conductor. The end of the conductor exposing, and the conductor introduced to a bore in a housing. The bore contains an electrical contact which abuts the conductor, the housing sealing against the metallic impermeable layer to isolate the bore of the housing. The cable includes an outer coating, this outer coating being removed to expose the metallic impermeable layer. One cable may introduced to a first bore of the housing, and a second cable is introduced to a second bore of the housing, the conductors of both cables abutting electrical contacts, so that these contacts are electrically connected to one another, the housing sealing against the impermeable metal layer of each cable.
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