发明申请
- 专利标题: Conductor system
- 专利标题(中): 导体系统
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申请号: US10481871申请日: 2004-01-16
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公开(公告)号: US20040118590A1公开(公告)日: 2004-06-24
- 发明人: Philip Head
- 优先权: GB0115040.8 20010620; GB0119622.9 20010811; GB0211385.0 20020517
- 主分类号: H01B009/02
- IPC分类号: H01B009/02
摘要:
A connection is formed to a cable for transmitting power or telemetry data in a down hole environment. The cable includes a conductor, and a tubular metallic impermeable layer around the conductor. The end of the conductor exposing, and the conductor introduced to a bore in a housing. The bore contains an electrical contact which abuts the conductor, the housing sealing against the metallic impermeable layer to isolate the bore of the housing. The cable includes an outer coating, this outer coating being removed to expose the metallic impermeable layer. One cable may introduced to a first bore of the housing, and a second cable is introduced to a second bore of the housing, the conductors of both cables abutting electrical contacts, so that these contacts are electrically connected to one another, the housing sealing against the impermeable metal layer of each cable.
公开/授权文献
- US07049506B2 Conductor system 公开/授权日:2006-05-23
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