发明申请
- 专利标题： Method and process of contact to a heat softened solder ball array
- 专利标题（中）： 接触热软化焊球阵列的方法和工艺
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申请号： US10651664申请日： 2003-08-29
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公开(公告)号： US20040035841A1公开(公告)日： 2004-02-26
- 发明人: David R. Hembree , Warren M. Farnworth
- 主分类号： H05B011/00
- IPC分类号： H05B011/00
摘要：
A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting nullsofteningnull temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
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