A method for producing an organic insulating film comprising the steps of coating a solution containing a dissolved organic resin having a structure of the following formula (1) on a substrate, and exposing the coated substrate at a temperature of 200null C. or more under an atmosphere of an oxygen partial pressure of 0.01 atm or less, 1 wherein each of R1 to R8 is independently selected from the group consisting of a hydrogen atom, fluorine atom, chlorine atom, bromine atom and iodine atom, alkyl groups having 1 to 10 carbon atoms, functional groups containing a double bond having 2 to 10 carbon atoms, functional groups containing a triple bond having 2 to 10 carbon atoms, a methoxy group, ethoxy group and propoxy group.