Invention Grant
- Patent Title: Method and device for predicting defects
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Application No.: US17748241Application Date: 2022-05-19
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Publication No.: US12298749B2Publication Date: 2025-05-13
- Inventor: Taelim Choi , Jun Haeng Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2021-0110942 20210823
- Main IPC: G05B19/418
- IPC: G05B19/418

Abstract:
A method and device for predicting a defect. The method includes determining a sequence between a plurality of sub-models by modeling a production process into the plurality of sub-models, mapping production process data into each of the plurality of sub-models, determining, by a corresponding sub-model, output data comprising defect information on a potential defect occurring in a corresponding step, for each of the plurality of sub-models, predicting information associated with a defect in the production process based on the output data corresponding to each of the plurality of sub-models, and inputting the output data of each of the sub-models to a subsequent sub-model of the corresponding sub-model, based on the sequence.
Public/Granted literature
- US20230054159A1 METHOD AND DEVICE FOR PREDICTING DEFECTS Public/Granted day:2023-02-23
Information query
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