Invention Grant
- Patent Title: Implantable medical device
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Application No.: US18594907Application Date: 2024-03-04
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Publication No.: US12179028B2Publication Date: 2024-12-31
- Inventor: Steven T. Deininger , Michael J. Baade , Charles E. Peters
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: A61N1/375
- IPC: A61N1/375 ; A61N1/08 ; A61N1/18 ; H01R43/00 ; H01R43/18 ; H01R43/20 ; H05K5/06 ; A61B90/50

Abstract:
An implantable medical device includes an enclosure sleeve and a top cap. The enclosure sleeve comprises an enclosure wall with at least a portion of the enclosure wall comprising the grade 5 titanium and having a thickness between 0.007 inches and 0.009 inches. The enclosure sleeve includes an open top end and an open bottom end that is opposite the open top end. The top cap includes a feedthrough block, a first top cap end portion, and a second top cap end portion. The first top cap end portion is configured to couple to the open top end of the enclosure sleeve, and the second top cap end portion configured to be positioned within the enclosure sleeve.
Public/Granted literature
- US20240207623A1 IMPLANTABLE MEDICAL DEVICE Public/Granted day:2024-06-27
Information query
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