- 专利标题: Copper/ceramic joined body and insulating circuit substrate
-
申请号: US17638875申请日: 2020-08-19
-
公开(公告)号: US12125765B2公开(公告)日: 2024-10-22
- 发明人: Nobuyuki Terasaki
- 申请人: MITSUBISHI MATERIALS CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI MATERIALS CORPORATION
- 当前专利权人: MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Locke Lord LLP
- 优先权: JP 19159566 2019.09.02 JP 20134070 2020.08.06
- 国际申请: PCT/JP2020/031238 2020.08.19
- 国际公布: WO2021/044844A 2021.03.11
- 进入国家日期: 2022-02-28
- 主分类号: H01L23/373
- IPC分类号: H01L23/373 ; B32B15/00 ; B32B15/04 ; B32B15/18 ; B32B18/00 ; C04B35/645 ; C04B37/02 ; H01L21/48 ; H01L23/12 ; H01L23/13 ; H01L23/15 ; H01L23/36 ; H05K1/03 ; H05K3/38
摘要:
A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.
公开/授权文献
信息查询
IPC分类: