Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US18233331Application Date: 2023-08-14
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Publication No.: US12119272B2Publication Date: 2024-10-15
- Inventor: Fu-Jung Chuang , Po-Jen Chuang , Yu-Ren Wang , Chi-Mao Hsu , Chia-Ming Kuo , Guan-Wei Huang , Chun-Hsien Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW 7120159 2018.06.12
- The original application number of the division: US16802463 2020.02.26
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/762 ; H01L21/8238 ; H01L27/092

Abstract:
A semiconductor device includes a fin-shaped structure on a substrate, a single diffusion break (SDB) structure in the fin-shaped structure to divide the first fin-shaped structure into a first portion and a second portion, and more than two gate structures on the SDB structure. Preferably, the more than two gate structures include a first gate structure, a second gate structure, a third gate structure, and a fourth gate structure disposed on the SDB structure.
Public/Granted literature
- US20230386939A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2023-11-30
Information query
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