发明授权
- 专利标题： Solid-state imaging device including groove with recessed and projecting sidewalls
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申请号： US17250775申请日： 2019-08-07
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公开(公告)号： US12107106B2公开(公告)日： 2024-10-01
- 发明人: Tomohiko Baba , Naoki Hideshima
- 申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址： JP Kanagawa
- 专利权人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人地址： JP Kanagawa
- 代理机构： CHIP LAW GROUP
- 优先权： JP 18169729 2018.09.11 JP 19135147 2019.07.23
- 国际申请： PCT/JP2019/031065 2019.08.07
- 国际公布： WO2020/054272A 2020.03.19
- 进入国家日期： 2021-03-02
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L27/146
摘要：
A solid-state imaging device includes a substrate on which a plurality of photoelectric conversion units has been formed, a groove portion provided on a side of a light-receiving surface of the substrate, and recessed and projecting portions provided on a side wall surface of the groove portion facing a side of the plurality of photoelectric conversion units.
公开/授权文献
- US20210202561A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS 公开/授权日：2021-07-01
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