Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US17719390Application Date: 2022-04-13
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Publication No.: US12107064B2Publication Date: 2024-10-01
- Inventor: Jen-Jui Yu , Chih-Chiang Tsao , Hsuan-Ting Kuo , Mao-Yen Chang , Hsiu-Jen Lin , Ching-Hua Hsieh , Hao-Jan Pei
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/367 ; H01L23/498 ; H01L25/18
Abstract:
A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).
Public/Granted literature
- US20230335523A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-10-19
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