- 专利标题： Microelectronic assemblies with inductors in direct bonding regions
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申请号： US17025843申请日： 2020-09-18
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公开(公告)号： US12107060B2公开(公告)日： 2024-10-01
- 发明人: Adel A. Elsherbini , Zhiguo Qian , Gerald S. Pasdast , Mohammad Enamul Kabir , Han Wui Then , Kimin Jun , Kevin P. O'Brien , Johanna M. Swan , Shawna M. Liff , Aleksandar Aleksov , Feras Eid
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corproation
- 当前专利权人： Intel Corproation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Akona IP PC
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065 ; H01L49/02
摘要：
Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.
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