- 专利标题: Bonded structure and method for producing same
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申请号: US17369743申请日: 2021-07-07
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公开(公告)号: US12104099B2公开(公告)日: 2024-10-01
- 发明人: Masami Saito , Koji Kondo , Hirotaka Miyano
- 申请人: DENSO CORPORATION
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP 19001657 2019.01.09
- 主分类号: C09J5/02
- IPC分类号: C09J5/02 ; C09J5/06 ; C09J163/00 ; F16B11/00
摘要:
A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.
公开/授权文献
- US20210332267A1 BONDED STRUCTURE AND METHOD FOR PRODUCING SAME 公开/授权日:2021-10-28
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