- 专利标题： Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board
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申请号： US17440499申请日： 2020-05-25
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公开(公告)号： US12103999B2公开(公告)日： 2024-10-01
- 发明人: Akihiro Nakamura , Yuji Takase , Hayato Sawamoto , Yoshikazu Suzuki , Shuji Nomoto , Shota Okade
- 申请人： Showa Denko Materials Co., Ltd.
- 申请人地址： JP Tokyo
- 专利权人： RESONAC CORPORATION
- 当前专利权人： RESONAC CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： FITCH, EVEN, TABIN & FLANNERY, LLP
- 优先权： JP 19102945 2019.05.31
- 国际申请： PCT/JP2020/020614 2020.05.25
- 国际公布： WO2020/241595A 2020.12.03
- 进入国家日期： 2021-09-17
- 主分类号： C08F290/14
- IPC分类号： C08F290/14 ; G03F7/031 ; H01L23/14 ; H05K1/03 ; H05K3/46
摘要：
The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.
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