- Patent Title: Gate structures in transistor devices and methods of forming same
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Application No.: US17464369Application Date: 2021-09-01
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Publication No.: US12087775B2Publication Date: 2024-09-10
- Inventor: Ting-Gang Chen , Bo-Cyuan Lu , Tai-Chun Huang , Chi On Chui , Chieh-Ping Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L21/02 ; H01L21/764 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/786

Abstract:
A semiconductor device includes first transistor having a first gate stack and first source/drain regions on opposing sides of the first gate stack; a second transistor having a second gate stack and second source/drain regions on opposing sides of the second gate stack; and a gate isolation structure separating the first gate stack from the second gate stack. The gate isolation structure includes a dielectric liner having a varied thickness along sidewalls of the first gate stack and the second gate stack and a dielectric fill material over the dielectric liner, wherein the dielectric fill material comprises a seam.
Public/Granted literature
- US20230008494A1 GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME Public/Granted day:2023-01-12
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