- 专利标题： Systems and methods for wafer bond monitoring
-
申请号： US18448766申请日： 2023-08-11
-
公开(公告)号： US12085518B2公开(公告)日： 2024-09-10
- 发明人: Chih-Yu Wang , Hsi-Cheng Hsu
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Seed IP Law Group LLP
- 分案原申请号： US16806199 2020.03.02
- 主分类号： G01N21/95
- IPC分类号： G01N21/95 ; H01L21/50 ; H01L21/60 ; H01L21/66
摘要：
Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
公开/授权文献
- US20230393081A1 SYSTEMS AND METHODS FOR WAFER BOND MONITORING 公开/授权日：2023-12-07
信息查询
