Invention Grant
- Patent Title: Microstructure control of conducting materials through surface coating of powders
-
Application No.: US17184802Application Date: 2021-02-25
-
Publication No.: US12084763B2Publication Date: 2024-09-10
- Inventor: Marc Shull , Peter Reimer , Hong P. Gao , Chandra V. Deshpandey
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: C04B35/626
- IPC: C04B35/626 ; C04B35/581 ; C04B35/628 ; C23C16/02 ; C23C16/40 ; C23C16/44 ; C23C16/442 ; C23C16/455 ; C23C16/505 ; H01L21/687
Abstract:
Exemplary deposition methods may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include striking a first plasma in the processing region, the first plasma including energetic hydrogen species. The method may include exposing the powder to the energetic hydrogen species in the processing region. The method may include chemically reducing the powder through a reaction of the powder with the energetic hydrogen species. The method may include removing process effluents including unreacted hydrogen from the processing region. The method may also include forming a layer of material on grains of the powder within the processing region.
Public/Granted literature
- US20220267899A1 MICROSTRUCTURE CONTROL OF CONDUCTING MATERIALS THROUGH SURFACE COATING OF POWDERS Public/Granted day:2022-08-25
Information query
IPC分类:
