- 专利标题： Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus
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申请号： US17100944申请日： 2020-11-23
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公开(公告)号： US12080609B2公开(公告)日： 2024-09-03
- 发明人: Hung-Jui Kuo , Hui-Jung Tsai , Chih Wang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 分案原申请号： US16655240 2019.10.17
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01N27/00 ; H01L21/02 ; H01L21/027 ; H01L21/033 ; H01L21/311
摘要：
Provided is a method of detecting photoresist scums and photoresist residues. A carrier is provided. The carrier has a photoresist layer with opening patterns therein. A plasma etching process is performed to the opening patterns of the photoresist layer. Charges are injected to the opening patterns of the photoresist layer. Whether a photoresist scum or residue is present in at least one of the opening patterns is detected.
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