Invention Grant
- Patent Title: Inspection jig and inspection device
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Application No.: US17636901Application Date: 2020-08-08
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Publication No.: US12072352B2Publication Date: 2024-08-27
- Inventor: Michio Kaida
- Applicant: NIDEC-READ CORPORATION
- Applicant Address: JP Kyoto
- Assignee: NIDEC READ CORPORATION
- Current Assignee: NIDEC READ CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Viering, Jentschura & Partner mbB
- Priority: JP 19155225 2019.08.28
- International Application: PCT/JP2020/032338 2020.08.08
- International Announcement: WO2021/039898A 2021.03.04
- Date entered country: 2022-02-21
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/073

Abstract:
An inspection jig includes: film-shaped wiring substrates each having one surface provided with an electrode; a pedestal that supports the wiring substrates which are laminated such that electrode regions are exposed, the electrode region being a region where the electrode is provided in each of the wiring substrates; and a plurality of probes which have base end portions in contact with the electrode regions and extend in a direction away from the electrode regions.
Public/Granted literature
- US20220357362A1 INSPECTION JIG AND INSPECTION DEVICE Public/Granted day:2022-11-10
Information query