- 专利标题： Superconducting circuit provided on an encapsulated vacuum cavity
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申请号： US17037191申请日： 2020-09-29
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公开(公告)号： US12041856B2公开(公告)日： 2024-07-16
- 发明人: Isaac Lauer , Karthik Balakrishnan , Jeffrey Sleight , David James Frank
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理商 Erik Johnson
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H10N60/01 ; H10N60/81 ; H10N60/83 ; H10N69/00 ; H01L21/56
摘要：
Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a superconducting circuit provided on an encapsulated vacuum cavity are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise a superconducting circuit provided on the encapsulated vacuum cavity.
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