- Patent Title: Superconducting circuit provided on an encapsulated vacuum cavity
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Application No.: US17037191Application Date: 2020-09-29
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Publication No.: US12041856B2Publication Date: 2024-07-16
- Inventor: Isaac Lauer , Karthik Balakrishnan , Jeffrey Sleight , David James Frank
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Erik Johnson
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H10N60/01 ; H10N60/81 ; H10N60/83 ; H10N69/00 ; H01L21/56
Abstract:
Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a superconducting circuit provided on an encapsulated vacuum cavity are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise a superconducting circuit provided on the encapsulated vacuum cavity.
Public/Granted literature
- US20220102613A1 SUPERCONDUCTING CIRCUIT PROVIDED ON AN ENCAPSULATED VACUUM CAVITY Public/Granted day:2022-03-31
Information query
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