A semiconductor package includes a semiconductor device on a first redistribution substrate and having a first sidewall, and a mold layer that covers the semiconductor device and the first redistribution substrate. The first redistribution substrate includes a first redistribution dielectric layer, a first reinforcement pattern on the first redistribution dielectric layer and overlapping the semiconductor device and the mold layer, and first and second bonding pads that penetrate the first redistribution dielectric layer and contact the first reinforcement pattern. The second bonding pad is spaced apart from the first bonding pad in a first direction. The first bonding pad has a first width in a second direction orthogonal to the first direction. When viewed in a plan view, the first reinforcement pattern has a second width in the second direction below the first sidewall. The second width is greater than the first width.