- 专利标题： Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure
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申请号： US17960767申请日： 2022-10-05
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公开(公告)号： US12033949B2公开(公告)日： 2024-07-09
- 发明人: Yu-Hung Lin , Chih-Wei Wu , Chia-Nan Yuan , Ying-Ching Shih , An-Jhih Su , Szu-Wei Lu , Ming-Shih Yeh , Der-Chyang Yeh
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/56 ; H01L21/768 ; H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L23/48
摘要：
A package structure and method of forming the same are provided. The package structure includes a first die and a second die disposed side by side, a first encapsulant laterally encapsulating the first and second dies, a bridge die disposed over and connected to the first and second dies, and a second encapsulant. The bridge die includes a semiconductor substrate, a conductive via and an encapsulant layer. The semiconductor substrate has a through substrate via embedded therein. The conductive via is disposed over a back side of the semiconductor substrate and electrically connected to the through substrate via. The encapsulant layer is disposed over the back side of the semiconductor substrate and laterally encapsulates the conductive via. The second encapsulant is disposed over the first encapsulant and laterally encapsulates the bridge die.
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