Invention Grant
- Patent Title: Method of manufacturing semiconductor devices with a paddle and electrically conductive clip and corresponding semiconductor device
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Application No.: US17498328Application Date: 2021-10-11
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Publication No.: US12033926B2Publication Date: 2024-07-09
- Inventor: Federico Giovanni Ziglioli
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy LLC
- Priority: IT 2018000020998 2018.12.24
- The original application number of the division: US16707875 2019.12.09
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L21/768 ; H01L23/31 ; H01L23/498 ; H01L21/60
Abstract:
A semiconductor chip is mounted on a leadframe. A first portion of an insulating package for the semiconductor chip is formed from laser direct structuring (LDS) material molded onto the semiconductor chip. A conductive formation (provided by laser-drilling the LDS material and plating) extends between the outer surface of the first portion of insulating package and the semiconductor chip. An electrically conductive clip is applied onto the outer surface of the first portion of the insulating package, with the electrically conductive clip electrically coupled to the conductive formation and the leadframe. A second portion of the insulating package is made from package molding material (epoxy compound) molded onto the electrically conductive clip and applied onto the outer surface of the first portion of the insulating package.
Public/Granted literature
- US20220028769A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE Public/Granted day:2022-01-27
Information query
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