- 专利标题: Structures for low temperature bonding using nanoparticles
-
申请号: US18145310申请日: 2022-12-22
-
公开(公告)号: US12027487B2公开(公告)日: 2024-07-02
- 发明人: Cyprian Emeka Uzoh
- 申请人: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- 申请人地址: US CA San Jose
- 专利权人: Adeia Semiconductor Technologies LLC
- 当前专利权人: Adeia Semiconductor Technologies LLC
- 当前专利权人地址: US CA San Jose
- 代理机构: Knobbe Martens Olson & Bear LLP
- 分案原申请号: US15336192 2016.10.27
- 主分类号: H01L23/538
- IPC分类号: H01L23/538 ; H01L23/00 ; H01L25/00 ; H01L25/065
摘要:
A method of making an assembly can include juxtaposing a top surface of a first electrically conductive element at a first surface of a first substrate with a top surface of a second electrically conductive element at a major surface of a second substrate. One of: the top surface of the first conductive element can be recessed below the first surface, or the top surface of the second conductive element can be recessed below the major surface. Electrically conductive nanoparticles can be disposed between the top surfaces of the first and second conductive elements. The conductive nanoparticles can have long dimensions smaller than 100 nanometers. The method can also include elevating a temperature at least at interfaces of the juxtaposed first and second conductive elements to a joining temperature at which the conductive nanoparticles can cause metallurgical joints to form between the juxtaposed first and second conductive elements.
公开/授权文献
信息查询
IPC分类: