- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US16968875申请日: 2020-06-30
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公开(公告)号: US12021122B2公开(公告)日: 2024-06-25
- 发明人: Anbang Zhang , King Yuen Wong
- 申请人: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- 申请人地址: CN Zhuhai
- 专利权人: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- 当前专利权人: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- 当前专利权人地址: CN Zhuhai
- 代理机构: JCIPRNET
- 国际申请: PCT/CN2020/099172 2020.06.30
- 国际公布: WO2022/000247A 2022.01.06
- 进入国家日期: 2020-08-11
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L23/31 ; H01L29/20 ; H01L29/205 ; H01L29/423 ; H01L29/66 ; H01L29/778
摘要:
Some embodiments of the disclosure provide a semiconductor device. The semiconductor device comprises: a substrate; a first nitride semiconductor layer on the substrate; a second nitride semiconductor layer on the first nitride semiconductor layer and having a band gap greater than a band gap of the first nitride semiconductor layer; a group III-V dielectric layer disposed on the second nitride semiconductor layer; a gate electrode disposed on the second nitride semiconductor layer; and a first passivation layer disposed on the group III-V dielectric layer, wherein the group III-V dielectric layer is separated from the gate electrode by the first passivation layer.
公开/授权文献
- US20220376064A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2022-11-24
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