- 专利标题： Reducing keep-out-zone area for a semiconductor device
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申请号： US17028484申请日： 2020-09-22
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公开(公告)号： US12021060B2公开(公告)日： 2024-06-25
- 发明人: Kevin Du , Hope Chiu , Zengyu Zhou , Alex Zhang , Vincent Jiang , Shixing Zhu , Paul Qu , Yi Su , Rui Yuan
- 申请人： Western Digital Technologies, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Western Digital Technologies, Inc.
- 当前专利权人： Western Digital Technologies, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Morgan, Lewis & Bockius LLP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L23/31 ; H01L25/00 ; H01L25/065
摘要：
A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
公开/授权文献
- US20220093559A1 REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE 公开/授权日：2022-03-24
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