- 专利标题: Semiconductor device
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申请号: US17814840申请日: 2022-07-26
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公开(公告)号: US12021050B2公开(公告)日: 2024-06-25
- 发明人: Ming-Ho Tsai , Jyun-Hong Chen , Chun-Chen Liu , Yu-Nu Hsu , Peng-Ren Chen , Wen-Hao Cheng , Chi-Ming Tsai
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: WPAT LAW
- 代理商 Anthony King
- 分案原申请号: US16353425 2019.03.14
- 主分类号: H01L23/00
- IPC分类号: H01L23/00
摘要:
A semiconductor device including: a first formation site and a second formation site for forming a first conductive bump and a second conductive bump; when a first environmental density corresponding to the first formation site is greater than a second environmental density corresponding to the second formation site, a cross sectional area of the second formation site is greater than a cross sectional area of the first formation site; wherein the first environmental density is determined by a number of formation sites around the first formation site in a predetermined range and the second environmental density is determined by a number of formation sites around the second formation site in the predetermined range; wherein a first area having the first environmental density forms an ellipse layout while a second area having the second environmental density forms a strip layout surrounding the ellipse layout.
公开/授权文献
- US20220367396A1 SEMICONDUCTOR DEVICE 公开/授权日:2022-11-17
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