发明授权
- 专利标题： Semiconductor packages having a die, an encapsulant, and a redistribution structure
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申请号： US17727242申请日： 2022-04-22
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公开(公告)号： US12021047B2公开(公告)日： 2024-06-25
- 发明人: Chung-Hao Tsai , Chia-Chia Lin , Kai-Chiang Wu , Chuei-Tang Wang , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 分案原申请号： US16177643 2018.11.01
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L23/14 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H01L23/522 ; H01L23/525 ; H01L23/66 ; H01L25/065 ; H01L25/07 ; H01L49/02
摘要：
An embodiment is a device including an integrated circuit die having an active side and a back side, the back side being opposite the active side, a molding compound encapsulating the integrated circuit die, and a first redistribution structure overlying the integrated circuit die and the molding compound, the first redistribution structure including a first metallization pattern and a first dielectric layer, the first metallization pattern being electrically coupled to the active side of the integrated circuit die, at least a portion of the first metallization pattern forming an inductor.
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