- 专利标题: Multilayer ceramic electronic component
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申请号: US17576200申请日: 2022-01-14
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公开(公告)号: US12020866B2公开(公告)日: 2024-06-25
- 发明人: Kyung Ryul Lee , Jong Suk Jeong , Chang Hak Choi
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20210036422 2021.03.22
- 主分类号: H01G4/008
- IPC分类号: H01G4/008 ; H01G4/12 ; H01G4/30
摘要:
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax) (Ti1-y(Zr, Hf)y)O3 (where, 0≤x≤1, 0≤y≤0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.
公开/授权文献
- US20220301770A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 公开/授权日:2022-09-22
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