Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method includes depositing a resistive layer over a substrate. A conductive structure is formed over the resistive layer. A first etch process is performed on the resistive layer to define a resistor segment of the resistive layer and a peripheral region of the resistive layer. The resistor segment is laterally separated from the peripheral region of the resistive layer. The peripheral region continuously laterally wraps around an outer perimeter of the resistor segment.