- 专利标题: Heater substrate, probe card substrate, and probe card
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申请号: US17799698申请日: 2021-02-09
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公开(公告)号: US12013433B2公开(公告)日: 2024-06-18
- 发明人: Daisuke Jingu , Hidenori Tanaka
- 申请人: KYOCERA Corporation
- 申请人地址: JP Kyoto
- 专利权人: Kyocera Corporation
- 当前专利权人: Kyocera Corporation
- 当前专利权人地址: JP Kyoto
- 代理机构: Volpe Koenig
- 优先权: JP 20024821 2020.02.18
- 国际申请: PCT/JP2021/004702 2021.02.09
- 国际公布: WO2021/166732A 2021.08.26
- 进入国家日期: 2022-08-15
- 主分类号: G01R31/28
- IPC分类号: G01R31/28 ; G01R1/073 ; H05B1/02 ; H05B3/03 ; H05B3/18 ; H05B3/28
摘要:
A heater substrate has an insulating substrate having a first surface and a second surface on the opposite side relative to the first surface and at least one heating element of spiral shape including plural heater wire pieces and positioned in or on the insulating substrate. The heating element of spiral shape has at least one adjustment section including a turn of all or some of the plural heater wire pieces. The plural heater wire pieces include a first heater wire piece and a second heater wire piece adjacent to the inner side of the first heater wire piece. In the adjustment section, the length of the first heater wire piece is smaller than the length of the second heater wire piece.
公开/授权文献
- US20230084616A1 HEATER SUBSTRATE, PROBE CARD SUBSTRATE, AND PROBE CARD 公开/授权日:2023-03-16
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