- 专利标题： Retention latch with spring mechanism
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申请号： US17001113申请日： 2020-08-24
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公开(公告)号： US11984685B2公开(公告)日： 2024-05-14
- 发明人: Phil Geng , Xiang Li , George Vergis , Mani Prakash
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Essential Patents Group, LLP
- 主分类号： H01R13/629
- IPC分类号： H01R13/629 ; H01R12/72 ; H01R13/631 ; H01R13/635 ; H05K5/02
摘要：
An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.
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