- 专利标题： Microelectronic device assemblies and packages including multiple device stacks and related methods
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申请号： US17805818申请日： 2022-06-07
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公开(公告)号： US11961825B2公开(公告)日： 2024-04-16
- 发明人: Aparna U. Limaye , Dong Soon Lim , Randon K. Richards , Owen R. Fay
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： TraskBritt
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/66 ; H01L21/78 ; H01L23/00 ; H01L23/64 ; H01L23/66 ; H01L25/00 ; H01L25/065 ; H01L25/18 ; H01Q1/22 ; H01Q1/48
摘要：
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.
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