- 专利标题: High frequency and high power thin-film component
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申请号: US17676889申请日: 2022-02-22
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公开(公告)号: US11949169B2公开(公告)日: 2024-04-02
- 发明人: Cory Nelson , Gheorghe Korony
- 申请人: KYOCERA AVX Components Corporation
- 申请人地址: US SC Fountain Inn
- 专利权人: KYOCERA AVX Components Corporation
- 当前专利权人: KYOCERA AVX Components Corporation
- 当前专利权人地址: US SC Fountain Inn
- 代理机构: Dority & Manning, P.A.
- 主分类号: H01Q1/22
- IPC分类号: H01Q1/22 ; H01L27/08 ; H01L49/02 ; H01Q5/314
摘要:
A resistive splitter can include a monolithic substrate and a patterned resistive layer formed over the monolithic substrate. The resistive splitter can include a first terminal, a second terminal, and a third terminal each connected with the patterned resistive layer. The resistive splitter can include at least one frequency compensating conductive layer formed over a portion of the patterned resistive layer. In some embodiments, the resistive splitter can exhibit a first insertion loss response between the first terminal and the second terminal that is greater than about −10 dB for frequencies ranging from about 0 GHz up to about 30 GHz.
公开/授权文献
- US20220278453A1 High Frequency And High Power Thin-Film Component 公开/授权日:2022-09-01
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