Invention Grant
- Patent Title: Temperature control in chemical mechanical polish
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Application No.: US16511649Application Date: 2019-07-15
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Publication No.: US11904430B2Publication Date: 2024-02-20
- Inventor: Kei-Wei Chen , Chih Hung Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: B24B37/015
- IPC: B24B37/015 ; B24B37/20 ; B24B37/30 ; B24B53/017
Abstract:
A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.
Public/Granted literature
- US20190337115A1 Temperature Control in Chemical Mechanical Polish Public/Granted day:2019-11-07
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