- 专利标题： Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith
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申请号： US17455709申请日： 2021-11-19
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公开(公告)号： US11901268B2公开(公告)日： 2024-02-13
- 发明人: Yoshio Tsukiyama , Teppei Yamaguchi
- 申请人： NGK Electronics Devices, Inc. , NGK Insulators, Ltd.
- 申请人地址： JP Mine
- 专利权人： NGK Electronics Devices, Inc.,NGK INSULATORS, LTD.
- 当前专利权人： NGK Electronics Devices, Inc.,NGK INSULATORS, LTD.
- 当前专利权人地址： JP Mine; JP Nagoya
- 代理机构： BURR PATENT LAW, PLLC
- 优先权： JP 19117393 2019.06.25
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48 ; H01L23/00 ; H01L23/66
摘要：
An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
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