A method to manufacture an electronic device to be applied to rubber article. The device comprises an electronic element, two layers of thermoplastic material which are arranged in a sandwich-like manner so as to contain, between one another, the electronic element, and at least an outer rubber layer arranged to cover an outer surface of at least one of the respective thermoplastic layers. The method comprises a preliminary step comprising (a) a deposition operation, during which an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least one outer surface of one of the layers of thermoplastic material; and (b) a heating operation, during which the layers of thermoplastic material on which the adhesive solution was applied are kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.