发明授权
- 专利标题: Circuit apparatus
-
申请号: US17438074申请日: 2019-12-19
-
公开(公告)号: US11894626B2公开(公告)日: 2024-02-06
- 发明人: Takamune Kikuta
- 申请人: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 申请人地址: JP Mie
- 专利权人: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Mie; JP Mie; JP Osaka
- 代理机构: Venjuris, P.C.
- 优先权: JP 19047232 2019.03.14
- 国际申请: PCT/JP2019/049862 2019.12.19
- 国际公布: WO2020/183850A 2020.09.17
- 进入国家日期: 2021-09-10
- 主分类号: H01R13/58
- IPC分类号: H01R13/58 ; H01R12/58 ; H01R12/73 ; H01R13/24 ; H01R13/514 ; H01R13/516 ; H05K1/11
摘要:
A circuit apparatus includes: a stacked body; and a plurality of terminals. The stacked body includes a plurality of layers. A plurality of holes that extend through the plurality of layers are formed in the stacked body. Each of the plurality of layers includes a connection member that is formed of a conductor. The connection member includes: a plurality of connection portions that are provided at positions corresponding to the plurality of holes; and a joining portion that connects the plurality of connection portions to each other. The plurality of terminals include a plurality of types of terminals that correspond to the plurality of layers. Each of the plurality of types of terminals can be selectively connected to the connection portion of a corresponding one of the plurality of layers by being inserted into a predetermined one of the plurality of holes.
公开/授权文献
- US20220255249A1 CIRCUIT APPARATUS 公开/授权日:2022-08-11
信息查询