A semiconductor package includes; a lower connection structure, a semiconductor chip on the lower connection structure, an intermediate connection structure on the lower connection structure, a sealing layer covering the semiconductor chip, and an upper connection structure including a first upper insulating layer on the sealing layer, a first upper conductive pattern layer on the first upper insulating layer, and a first upper via penetrating the first upper insulating layer to directly connect the first upper conductive pattern layer to the intermediate connection structure. A height from an upper surface of the lower connection structure to an upper surface of the sealing layer is less than or equal to a maximum height from the upper surface of the lower connection structure to an upper surface of the intermediate connection structure.