Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US17645087Application Date: 2021-12-20
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Publication No.: US11881879B2Publication Date: 2024-01-23
- Inventor: Hidetaka Takahashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 19124840 2019.07.03
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H04B1/04 ; H04B1/00 ; H04B1/03 ; H04L5/14

Abstract:
A radio-frequency module includes a mounting substrate, a power amplifier, a low-noise amplifier, at least one first transmission filter, and at least one first reception filter. The mounting substrate has a first main surface and a second main surface. The power amplifier is disposed on a side where the first main surface of the mounting substrate is located. The low-noise amplifier is disposed on a side where the second main surface of the mounting substrate is located. The first transmission filter allows a TDD transmission signal to pass therethrough. The first reception filter allows a TDD reception signal to pass therethrough. The first transmission filter is disposed on the side where the first main surface of the mounting substrate is located. The first reception filter is disposed on the side where the second main surface of the mounting substrate is located.
Public/Granted literature
- US20220116061A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2022-04-14
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