- 专利标题: Multilayer capacitor
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申请号: US17702237申请日: 2022-03-23
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公开(公告)号: US11881357B2公开(公告)日: 2024-01-23
- 发明人: Tae Ho Yun , Su Bong Jang , Sang Jong Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20210185228 2021.12.22
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/008 ; H01G4/12 ; H01G4/012
摘要:
A multilayer capacitor includes: a body including a stack structure in which a first internal electrode and a second internal electrode are stacked on each other interposing a dielectric layer therebetween; and first and second external electrodes disposed on the body to be respectively connected to the first internal electrode and the second internal electrode. One of the first internal electrode and the second internal electrode includes a recess portion disposed in one surface thereof, and providing a deviation in a distance between the first and second internal electrodes, TD indicates a thickness of a portion of the dielectric layer, based on a portion positioned on the one surface and not in the recess portion, TR indicates a recession depth of a portion positioned on the one surface and recessed by the recess portion, and (TR/TD) is greater than zero and less than (½).
公开/授权文献
- US20230197348A1 MULTILAYER CAPACITOR 公开/授权日:2023-06-22
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