- 专利标题： Patterned fiber substrate
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申请号： US17417506申请日： 2019-12-18
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公开(公告)号： US11864314B2公开(公告)日： 2024-01-02
- 发明人: Kohei Hayashi , Soichi Obata , Yasuhiro Shirotani , Masashi Nitani , Mayumi Uno , Kazuki Maeda
- 申请人： KURARAY CO., LTD. , OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- 申请人地址： JP Kurashiki
- 专利权人： KURARAY CO., LTD.,OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- 当前专利权人： KURARAY CO., LTD.,OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- 当前专利权人地址： JP Kurashiki; JP Izumi
- 代理机构： Element IP, PLC
- 优先权： JP 18243509 2018.12.26 JP 19093650 2019.05.17
- 国际申请： PCT/JP2019/049616 2019.12.18
- 国际公布： WO2020/137742A 2020.07.02
- 进入国家日期： 2021-06-23
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; D06M10/00 ; D06M23/16 ; H05K3/28 ; H05K3/46
摘要：
The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.
公开/授权文献
- US20220117083A1 PATTERNED FIBER SUBSTRATE 公开/授权日：2022-04-14
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