发明授权
- 专利标题: Measurement device
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申请号: US17976612申请日: 2022-10-28
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公开(公告)号: US11859969B2公开(公告)日: 2024-01-02
- 发明人: Hideki Morii , Takuya Inoue
- 申请人: Tokyo Seimitsu Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: TOKYO SEIMITSU CO., LTD.
- 当前专利权人: TOKYO SEIMITSU CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP 20080058 2020.04.30
- 主分类号: G01B5/00
- IPC分类号: G01B5/00 ; G01B3/00 ; G01B3/56 ; G01B5/14 ; G01B5/20 ; G01B5/28
摘要:
A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are α, β and γ respectively, the measurement device satisfies a condition of (α+γ)−1/2α≤β≤(α+γ)+1/2α.
公开/授权文献
- US20230052870A1 MEASUREMENT DEVICE 公开/授权日:2023-02-16
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