- 专利标题： Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
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申请号： US17558341申请日： 2021-12-21
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公开(公告)号： US11856687B2公开(公告)日： 2023-12-26
- 发明人: Sandro Bulovic
- 申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG
- 申请人地址： DE Nuremberg
- 专利权人： SEMIKRON ELEKTRONIK GMBH & CO. KG
- 当前专利权人： SEMIKRON ELEKTRONIK GMBH & CO. KG
- 当前专利权人地址： DE Nuremberg
- 代理机构： Nolte Lackenbach Siegel
- 代理商 Andrew F. Young
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L23/495
摘要：
A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.
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