Invention Grant
- Patent Title: Reducing substrate surface scratching using machine learning
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Application No.: US18068469Application Date: 2022-12-19
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Publication No.: US11835927B2Publication Date: 2023-12-05
- Inventor: Kartik B Shah , Satish Radhakrishnan , Karthik Ramanathan , Karthikeyan Balaraman , Adolph Miller Allen , Xinyuan Chong , Mitrabhanu Sahu , Wenjing Xu , Michael Sterling Jackson , Weize Hu , Feng Chen
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: G05B13/02
- IPC: G05B13/02 ; G05B13/04

Abstract:
Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.
Public/Granted literature
- US20230121513A1 REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING Public/Granted day:2023-04-20
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