- 专利标题: Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer
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申请号: US17481647申请日: 2021-09-22
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公开(公告)号: US11817501B2公开(公告)日: 2023-11-14
- 发明人: Sung Dae Suk , Somnath Ghosh , Chen Zhang , Junli Wang , Devendra K. Sadana , Dechao Guo
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: CANTOR COLBURN LLP
- 代理商 Samuel Waldbaum
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L25/07 ; H01L29/08
摘要:
A semiconductor device fabrication method is provided. The semiconductor device fabrication method includes frontside semiconductor device processing on a frontside of a wafer, flipping the wafer, backside semiconductor device processing on a backside of the wafer and backside and frontside contact formation processing on the backside and frontside of the wafer, respectively.
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