- 专利标题: Electronic component, circuit board, and method of mounting electronic component on circuit board
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申请号: US18098786申请日: 2023-01-19
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公开(公告)号: US11817263B2公开(公告)日: 2023-11-14
- 发明人: Eiji Teraoka , Hirokazu Takashima
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Nagaokakyo
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: KEATING & BENNETT, LLP
- 优先权: JP 18189163 2018.10.04
- 主分类号: H01G4/12
- IPC分类号: H01G4/12 ; H01G4/228 ; H01G4/30 ; H01G4/012
摘要:
An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.
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