A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of greater than 0 degrees to about 5 degrees. The conductive traces and pads are formed into the channels and pockets by electrolytic metallization. In addition, the outer surface of conductive traces and pads are flush with the sides of the 3D dielectric substrate.