Invention Grant
- Patent Title: Manufacturing method of array substrate
-
Application No.: US16965495Application Date: 2019-07-22
-
Publication No.: US11798959B2Publication Date: 2023-10-24
- Inventor: Wei Yang , Guangcai Yuan , Ce Ning , Xinhong Lu , Tianmin Zhou , Lizhong Wang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- International Application: PCT/CN2019/097131 2019.07.22
- International Announcement: WO2021/012158A 2021.01.28
- Date entered country: 2020-07-28
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/12

Abstract:
Provided are an array substrate and a manufacturing method thereof, the manufacturing method includes: forming a first active layer on a base substrate; forming a second active layer; forming a second gate on the second active layer; forming a first insulating layer covering the first active layer on the second gate; patterning the first insulating layer to form first via holes at both sides of the second gate to expose the second active layer; depositing a first metal layer in the first via holes and on the first insulating layer; patterning the first metal layer, removing a part of the first metal layer above the first active layer to expose the first insulating layer; etching the first insulating layer using the patterned first metal layer as a mask, forming second via holes above the first active layer to expose the first active layer; cleaning the exposed first active layer.
Public/Granted literature
- US20230163145A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-05-25
Information query
IPC分类: