Invention Grant
- Patent Title: Dielectric thin film, capacitor including the dielectric thin film, and method for manufacturing the dielectric thin film
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Application No.: US17306310Application Date: 2021-05-03
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Publication No.: US11791373B2Publication Date: 2023-10-17
- Inventor: Hyungjun Kim , Changsoo Lee , Chan Kwak , Euncheol Do
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR 20200159091 2020.11.24
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L49/02

Abstract:
Provided is a method of preparing a dielectric film having a nanoscale three-dimensional shape and including an oxide, the oxide represented by RAMBOC where R is a divalent element and M is a pentavalent element, the method may include synthesizing a target material, the target material including the divalent element and the pentavalent element; and forming the oxide by depositing the divalent element and the pentavalent element, from the target material, onto a substrate such that the oxide includes a perovskite-type crystal structure, 1.3
Public/Granted literature
Information query
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