Invention Grant
- Patent Title: Electronic device including acoustic assembly
-
Application No.: US17519760Application Date: 2021-11-05
-
Publication No.: US11785126B2Publication Date: 2023-10-10
- Inventor: Choonghyo Park , Kiwon Kim , Myoungsung Sim , Changshik Yoon , Woojin Cho , Joonrae Cho , Hyunggwang Kang , Byounghee Lee , Hochul Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR 20200147763 2020.11.06 KR 20200177794 2020.12.17
- Main IPC: H04M1/03
- IPC: H04M1/03 ; H04M1/02 ; H04R1/34

Abstract:
An electronic device according to various embodiments of the disclosure may include: a first housing, a second housing accommodating at least a portion of the first housing and configured to guide sliding movement of the first housing, and an acoustic assembly including an acoustic component comprising acoustic circuitry disposed inside the first housing, a first pipe extending from the acoustic component toward a first end of the first housing, and a second pipe extending from an edge portion of the second housing to a second end of the second housing toward the first housing. The first end of the first housing or the second end of the second housing for connecting the first pipe and the second pipe when the first housing is accommodated in the second housing may be provided in a shape having a specified slope with respect to the edge portion of the second housing.
Public/Granted literature
- US20220150340A1 ELECTRONIC DEVICE INCLUDING ACOUSTIC ASSEMBLY Public/Granted day:2022-05-12
Information query